BONDPLAS ENGINEERING

BONDPLAS ENGINEERING company details in Singapore Data Register for Companies. Find address and other contact information about BONDPLAS ENGINEERING.

About BONDPLAS ENGINEERING in No category category (Company Registration Number: 53008004D)

BONDPLAS ENGINEERING is a company registered in Singapore. To check the full profile, please click Company details.
20 WOODLANDS LINK #08-16 Singapore 738733
Company details

Company details

Address:

20 WOODLANDS LINK #08-16 Singapore 738733    
In absence of a business address update, by the profile owner, the information shown above is the Registered Address from the last update obtained from ACRA.

Description:

ENGINEERING ACTIVITIES NEC

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